Conference Information
- Home

Attendee Information

Technical Program


SPI 2009 Archives

Session 1: Packaging and Power Integrity
Session chair: V. Ricchiuti, TechnoLabs R&D (I)
Fast Analysis of Power Distribution Networks using Waveform Relaxation
Ram Achar, Michel Nakhla, Arvind Sridhar, Harjot Dhindsa, Douglas Paul
Characterization and modeling of the power delivery networks of memory chips
I.S. Stievano, I.A. Maio, L. Rigazio, F.G. Canavero, R.Izzi, A.Girardi, T. Cunha, H. Teixeira, J.C. Pedro

Session 2: Transmission Lines and High-Speed Channels
Session chair: R. Khazaka, Univ. McGill (CAN)
Experimental Validation of the RC-Interconnect Effect Equalization with Negative Group Delay Active Circuit in Planar Hybrid Technology
Blaise Ravelo, André Pérennec and Marc Le Roy
Multi-Gigabit Serial Link Emissions and Mobile Terminal Antenna Interference
Martti Voutilainen, Markku Rouvala, Pia Kotiranta, Tapani von Rauner
Compromised Impedance Match Design for Signal Integrity of Pogo Pins Structures with Different Signal-Ground Patterns
Ruey-Bo Sun, Ruey-Beei Wu, and Shih-Wei Haiso

Session 3: 3D Modeling
Session chair: F. G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Torino (I)
An Equivalent Circuit Model for the Identification of the Stub Resonance due to Differential Vias on PCB
Vittorio Ricchiuti, Francesco de Paulis, Antonio Orlandi
High Frequency Characterization and Modeling of High Density TSV in 3D Integrated Circuits
C. Bermond, L. Cadix, A. Farcy, T. Lacrevaz, B. Fléchet, P. Leduc
Investigation of the Interactions Between Vias and the Power-Bus
Gerd Heinrich, Stefan Dickmann

Session 4: New Interconnect Technology
Session chair: U. Arz, Physikalisch-Technische Bundesanstalt, Braunschweig (D)
Signal Integrity Analysis of Carbon Nanotube on-chip Interconnects
A.G. Chiariello, A. Maffucci, G. Miano
Self Consistent Simulation of Optoelectronic Circuits using a SPICE like Framework
P. Gunupudi, T. Smy, J. Klein and J. Jakubczyk
Signal Integrity of Femtosecond Pulses Patterns in a 500Gb/s All-Optical Demultiplexer for OTDM Interconnections by using Nonlinearities in Semiconductor Optical Amplifiers
C. Crognale, and A. Di Giansante

Session 5: Linear Macromodeling
Session chair: W. Schilders, NXP Semiconductors & TU Eindhoven (NL)
Parameterized macromodels of multiconductor transmission lines
G. Antonini, F. Ferranti, T. Dhaene, L. Knockaert
Black-box identification of delay-based macromodels from measured terminal responses
Piero Triverio, Stefano Grivet-Talocia, Alessandro Chinea
Modeling Multi-Port Systems from Frequency Response Data via Tangential Interpolation
Sanda Lefteriu and Athanasios C. Antoulas
Passivity Verification and Enforcement of Delayed Rational Function Macromodels from Networks Characterized by Tabulated Data
Andrew Charest, Michel Nakhla, Ram Achar, and Changzhong Chen

Session 6: On-Chip Interconnects
Session chair: H. Grabinski, Univ. Hannover, Institut fur Theoretische Elektrotechnik, Hannover (D)
Polarization Mode Basis Functions for Modeling Insulator-Coated Through-Silicon Via (TSV) Interconnections
Ki Jin Han, Madhavan Swaminathan
Equivalent Victim Model of the Coupled Interconnects for Simulating Crosstalk Induced Glitches and Delays
Shehzad Hasan, Ajoy K. Palit, Walter Anheier
On the Quantification and Improvement of the Models for Surface Roughness
Brian Curran

Session 7: Signal and Power Integrity
Session chair: M. S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN)
Differential to Common Mode Conversion Due to Asymmetric Ground Via Configurations
Renato Rimolo-Donadio, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster
Supply Voltage Drop Study Considering On-Chip Self Inductance of a 32-bit Processor’s Power Grid
Daniel A. Andersson, Björn Nilsson, Johnny Pihl, Lars Svensson, and Per Larsson-Edefors
Extraction of Broadband Error Boxes for Microprobes and Recessed Probe Launches for Measurement of Printed Circuit Board Structures
Miroslav Kotzev, Renato Rimolo-Donadio, Christian Schuster
Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis
Daeil Kwon, Michael H. Azarian, and Michael Pecht

Session 8: Linear Macromodeling
Session chair: M. Swaminathan, Georgia Institute of Technology, Atlanta (USA)
On the Construction of Uniformly Stable Multivariate Interconnect Macromodels
Piero Triverio, Stefano Grivet-Talocia, Michel Nakhla
Fast Passivity Enforcement Technique for Common-Pole S-Parameter Multiport Systems
Dirk Deschrijver, Tom Dhaene
Vector Fitting vs Levenberg-Marquardt : Some Experiments
L. Knockaert, F. Ferranti, T. Dhaene
Identifying Bands of Passivity Violations For Scattering-Based Macromodels by a Half-Size Test Matrix
Bjorn Gustavsen

Session 9: Interconnect Modeling
Session chair: T. Dhaene, Ghent University (B)
Conductor Modeling with the Surface Admittance Operator of Triangles
Thomas Demeester , Daniël De Zutter
Acceleration of Transverse Waveform Relaxation Using Waveform Compression
T. Maestri, I.M. Elfadel, A. Ruehli

Poster Session
Session chair: Y. Quéré, Brest University, Lab-STICC (F)
Modeling the Interconnection of a Pseudo-Differential Link Using a Wide Return Conductor
Frederic Broydé, Evelyne Clavelier
Sensitivity of output response to geometrical dimensions in VLSI interconnects
Agnieszka Ligocka-Wardziñska, Wojciech Bandurski
Low-Impedance and High-Q Transmission Line for mmw VCO
You Nomiyama, Win Chaivipas, Kenichi Okada, and Akira Matsuzawa
BER Simulation for High-Speed Serial Links with Crosstalk, Noise, ISI and Jitter using Quasi-Analytical Method
Dingqing Lu, Chunxing Huang, Xiaoqing Dong and Daoxue Hu
Integral Power Net Integrity Analysis of a packaged u-Controller System including the u-Controller on-Chip Power Net Distribution
Ekkehard Miersch, Mehmet Goekcen , Thomas Steinecke
Effect of Underlayer Dummy Fills on On-Chip Transmission Line
Akira Tsuchiya and Hidetoshi Onodera
Towards Supply-Grid-Based Derating of Timing Margins
Svensson, Pihl, Andersson, Nilsson, Larsson-Edefors
Analysis of EMI Dependence on Signal Duty and Supplied Voltage
Pilsoo Lee, Jae-Kyung Wee, Inchae Song, and Boo-Gyoun Kim
Measurement and simulation correlation of backplane serdes channel
Perry Qu

SPI Archives
- 2009
- 2008

Contact