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Tutorial
Monday, May 12th, 2008 (9h30-18h30)
When Digital Becomes Analog - Interfaces in High Speed Test
Wolfgang Maichen, Teradyne, Inc.
Agoura Hills, CA, USA
Summary
Successful high speed digital test requires understanding the behavior of all components involved (device, test equipment, interface),
as well as the interaction between them. The boundaries between digital and analog disappear. Connections have to be treated as
transmission lines, with every little imperfection impacting system performance, deteriorating test accuracy, and reducing yield.
Maintaining signal integrity is paramount in order to achieve meaningful results, and it requires good knowledge of signal path
behavior, proper choice of termination techniques, and good design of the interface. While the tester itself is usually given and not
easily modified, large improvements are possible by careful design of the interconnecting load board or probe interface. Apart from
theoretical knowledge, methods to quantify the performance of a given design by measurements are necessary as well.
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Intended Audience
Test engineers, product engineers, characterization engineers, application engineers, chip, board or system designers with interest in test and characterization, printed circuit board designers, and anyone who deals with data rates beyond 100 Mbits/sec and/or clock frequencies above 100 MHz.
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Program
- Basic considerations
- Low Pass Filters / Parasitics
- Transmission Lines
- Device and Package Modeling
- High-Performance Printed Circuit Boards
- Tester and Termination Modeling
- Characterization with Time Domain Reflectometry
- Correlation between Test and Spec
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Biography
Wolfgang Maichen, Phd., is currently working as a manager of the IC characterization department for Teradyne, Inc. in
Agoura Hills, California. His work centers on test and measurement techniques, signal integrity, bench-top IC characterization of
high-speed digital and mixed signal ASICs, PCB design, and board-level circuit design. He frequently holds tutorials about high-speed
test issues for internal as well as external audiences. Prior to this position, he worked as an IC characterization engineer before that
as an applications engineer for high-speed test at the same location.
Before joining Teradyne, Mr. Maichen worked as a product engineer for Siemens Semiconductor in France, performing electrical
failure analysis, reliability studies, and bench-top semiconductor device characterization.
Mr. Maichen is author of a book titled \"Digital Timing Measurements\", Springer 2006, ISBN 0-387-31418-0. In addition he is
co-author of the book \"Advances in Electronic Testing: Challenges and Methodologies\" (Editor: Prof. Dimitris Gizopoulos), ISBN
0-387-29408-2, Springer 2006.
Mr. Maichen holds a Masters degree in Applied Physics and a Ph.D. in the same subject from the University of Technology in Graz,
Austria. He has published several papers in international peer-reviewed journals and has given presentations and tutorials at
international conferences.
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Registration information
This course develops over six hours of teaching. The registration includes the course documentation, lunch and the coffee breaks.
In order to register, add the tutorial fee to the workshop registration fee in the website registration form.
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